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Sika Sikadur 22 Lo-Mod FS 2-Component Epoxy Resin Binder, 100% Solids, 4 gal Kit
Regular price $480.00Sika Sikadur 22 Lo-Mod FS 2-Component Epoxy Resin Binder, 100% Solids, 4 gal Kit
Sika Sikadur 22 Lo-Mod FS is a two-component, 100% solids, moisture-tolerant epoxy resin binder supplied as a 4 gallon kit. It mixes at an easy 1:1 volume ratio and conforms to ASTM C-881 Type III, Grade 2, Class C and AASHTO M-235, making it suited to polymer chip seal and broadcast overlay work.
Key Features:
- Two-component epoxy: 2-component, 100% solids epoxy resin binder with excellent strength development.
- Moisture tolerant: Tolerant to moisture both before and after cure.
- Easy 1:1 mix: Convenient A:B mix ratio of 1:1 by volume.
- Leveling viscosity: Leveling viscosity enables easy, efficient application of a broadcast overlay.
- Standards conforming: Conforms to ASTM C-881, Type III, Grade-2, Class-C and AASHTO M-235.
- USDA-certifiable: Material is USDA-certifiable.
Specifications Table:
| Specification | Details |
|---|---|
| Brand | Sika |
| Sell unit | 4 gal two-component kit |
| Product line | Sikadur-22 Lo-Mod FS |
| Material | 2-component, 100% solids epoxy resin binder |
| Coverage per unit | Per 4 gal kit (spread rate depends on application and aggregate) |
| Mix ratio | A:B = 1:1 by volume |
| Pack quantity | 4 gal kit |
| Approvals | ASTM C-881 Type III, Grade 2, Class C; AASHTO M-235; USDA-certifiable |
| Moisture tolerance | Tolerant to moisture before and after cure |
| Intended use | Epoxy resin binder for polymer chip seal / broadcast overlay applications |
Coverage & How Much You Need:
One 4 gal kit is the batch unit for this binder; coverage depends on the specified application rate and chip/aggregate spread for your project. Mix only full kits to maintain the 1:1 volume ratio.
Fit and Compatibility:
Used as the resin binder in Type 2 polymer chip seal systems and broadcast overlays per Sika DOT application procedures. Apply aggregate broadcast promptly over the wet resin; no aggregate or dispensing equipment is included.
Frequently Asked Questions (FAQ):
Q: What is included in the kit?
A: A 4 gallon two-component kit with resin and hardener in an A:B = 1:1 volume mix ratio.
Q: Is it moisture tolerant?
A: Yes, it tolerates moisture both before and after cure.
Q: What standards does it meet?
A: It conforms to ASTM C-881, Type III, Grade-2, Class-C and AASHTO M-235, and the material is USDA-certifiable.
Q: Why must I use a full kit?
A: The 1:1 by volume ratio requires whole kits to ensure proper cure and strength development.
Q: What is it used for?
A: As a binder for broadcast chip seal overlays, such as bridge deck polymer chip seal applications.
Expert Verdict — Reviewed by the SuperArbor Pro Desk
Batch full kits only and mix thoroughly to keep the 1:1 ratio uniform before broadcasting aggregate into the wet film. Its moisture tolerance makes it forgiving on damp decks, but avoid standing water and follow published temperature windows for cure. Choose this low-modulus grade where bridge deck movement demands a flexible binder.
Two-component epoxies can cause skin and eye irritation; wear gloves, eye protection and follow the Safety Data Sheet during mixing and application.
Order Sika Sikadur 22 Lo-Mod FS epoxy resin binder in 4 gal kits for your chip seal project.
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